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The Senate resolution recognizes UV+EB technology as pollution prevention processes that, unlike conventional technologies, emit little to no harmful emissions.
The California State Senate has adopted a resolution recognizing the benefits of ultraviolet (UV) and electron beam (EB) technologies, as well as the contributions of RadTech—The UV+EB Technology Non Profit Trade Association.
Steven Henning will discuss “Silane-Terminated Liquid Poly(butadienes) in Tread Formulations: A Mechanistic Study” in session C18 at 2 p.m. on October 9.
Steven Henning, researcher with TOTAL Cray Valley, will present a technical paper at this year’s International Elastomer Conference, which will be held October 8-10 in Cleveland, Ohio.
Gelest, Inc. recently announced that Barry Arkles, Ph.D., founder, president, and chief technology officer, is the recipient of the American Chemical Society 2020 Frederic Stanley Kipping Award in Silicon Chemistry.
AAMA 813-19, Voluntary Specification and Test Methods for Adhesives Used in Simulated Divided Lite Bars, was originally released in 2011 to establish minimum performance criteria for adhesive systems used in such attachments for the fenestration industry.
The American Architectural Manufacturers Association (AAMA) has updated a standard for adhesive systems designed to attach simulated divided lite (SDL) bars to glass.
Along with key topics on the management agendas of all future-focused Afera member companies, the war for talent and the next-generation workforce will be of particular focus at the Lisbon event.
Afera, the European Adhesive Tape Association, recently announced the launch of its 62nd Annual Conference, which will take place October 9-11 at the Pestana Palace Hotel in Lisbon, Portugal.
Nordson ASYMTEK, a Nordson company, reports that it will present ways to create reliable, efficient conformal coating and dispensing processes at SMTA International (SMTAI) 2019, which will be held September 24-26.
The Pressure Sensitive Tape Council (PSTC) recently announced its call for abstracts for the opportunity to present during the Building & Construction Industry: Markets and Applications Track at its upcoming annual event, the historically known Tape Summit, taking place in Orlando, Fla., May 6-9, 2020.
Interested parties are invited to share their knowledge and innovations on a range of topics at the 2020 World Adhesive & Sealant Conference, which will be held April 20-22 in Chicago.
The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.
At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.
ASC’s interactive new Emerging Leaders Workshop will include facilitated discussion and be structured to optimize learning between peers, providing tools and strategies for leveraging personal strengths and leading change.
Consistent with the theme of “Focus on the Future,” the Adhesive and Sealant Council (ASC) is introducing an Emerging Leaders Workshop to its Executive Leadership Conference programming.
