Articles Tagged with ''adhesives in electrical/electronic''

EC-1015HP epoxy potting compound from epoxySet Inc. is a heat-cure system designed for temperature cycling from -55 to 180 °C with significantly better crack resistance than traditional rigid epoxies. 

One of the primary drivers of this growth is the increasing demand for pressure-sensitive adhesives in the flexible packaging sector. 

The new UV acrylic adhesive, developed for the rapid securing of commutators, can be applied robotically and cures within seconds under UV light.

A new study from Transparency Market Research predicts the global pressure sensitive adhesives (PSAs) market will experience a compound annual growth rate of 5.2% from 2022 to 2031.

To tackle the need for sustainable materials and the changing electronics industry, solventless silicone PSAs present a promising alternative to traditional solvent-based silicone PSAs.

LG Chem stated that the company intends to grow its automotive adhesive business into a multi-million-dollar unit.

Creative Materials Inc. has launched two new products that offer alternatives to legacy materials used in the electronics, automotive, and aerospace industries.

A new adhesive that can be used to create ultra-fine structures within seconds, DELO DUALBOND EG4797 is creating new possibilities in heterogeneous integration and optical packaging applications. 

DELO recently announced the launch of an adhesive for bonding voice coil motors in smartphone camera assemblies. 

The engineering website has published five new selection guides with technical information about electronic component adhesives, electrically conductive adhesives, thermal adhesives, conformal coatings, and pottants and encapsulants.