EC-1015HP epoxy potting compound from epoxySet Inc. is a heat-cure system designed for temperature cycling from -55 to 180 °C with significantly better crack resistance than traditional rigid epoxies. As a low viscosity encapsulant, it is used for large and small potting applications with fragile components. The low CTE of 34 ppm/°C also keeps the stresses to a minimum. It offers superior bond strength to most substrates as well as very high chemical and moisture resistance.

EC-1015HP has a high thermal conductivity of 1.2W/m°K with a glass transition temperature of 162 °C. It is an ideal choice for protection of electrical components with a volume resistivity of 10*16 ohm-cm and a dielectric strength of 450V/ml.  

This formulation can be used in densely packaged power supplies, integrated circuits, tightly packed coils, and transformers without the cracking issues associated with most epoxies.

Learn more about epoxySet and its products at www.epoxyset.com.