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Home » Keywords » encapsulant

Items Tagged with 'encapsulant'

ARTICLES

Techsil electronic adhesives

TECHSIL: Electronics Adhesives

These adhesives were reportedly specially formulated for applications in the electronics and consumer electronics industry, where heat-sensitive parts need to be assembled.
July 25, 2019
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Techsil recently announced that it has launched a range of new adhesive products with low ion content that cure with UV, visible light, or moisture.
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Naval Undersea Warfare Center Signs Agreement with ALFA

NUWC XP-1 is a high-performance polyurethane developed for protection of marine acoustic and optical equipment.
May 17, 2017
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The Naval Undersea Warfare Center (NUWC) Division Newport has recently entered into an agreement with ALFA International Inc. for the commercialization of a high-performance polyurethane.


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TECHSIL: Encapsulants

October 20, 2016
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A new range of optically clear encapsulants are available from this company.
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WACKER: Encapsulants

October 10, 2016
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This company offers two new encapsulation compounds for light-emitting diodes (LED).
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Fiber Optic Center Adds Hernon Epoxy

Fiber Optic Center Inc. recently announced the addition of Hernon Tuffbond 302 epoxy adhesive to its epoxy line.
August 24, 2016
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The epoxy reportedly performs under temperature cycling from -54°C to 85°C.
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HENKEL ADHESIVE TECHNOLOGIES: Thermally Conductive Adhesive

April 12, 2016
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This company has developed a thermally conductive Technomelt material.
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Creative Materials Acquires Noelle Industries

September 3, 2015
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Creative Materials Inc. recently announced the acquisition of Noelle Industries, a manufacturer of encapsulants, potting compounds, adhesives and coatings.
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ELLSWORTH ADHESIVES EUROPE: Blog

July 7, 2015
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This company has launched a new blog.
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ELLSWORTH ADHESIVES EUROPE: Dow Corning Encapsulant

November 26, 2014
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This company now offers Dow Corning’s EE-3200 low-stress silicone encapsulant, a product designed for the solar power industry.
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HENKEL CORP.: Encapsulants

HENKEL CORP.: Encapsulants

April 7, 2014
No Comments
LOCTITE ECCOBOND EN 3810T and 3838T are novel encapsulant formulations that can be selectively applied to environmentally susceptible components.
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More Articles Tagged with 'encapsulant'
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March 8, 2021

IPC APEX EXPO 2021

IPC APEX EXPO 2021 will be a virtual event for the printed circuit board and electronics manufacturing industry.

March 8, 2021

Pittcon 2021

A virtual event in 2021, Pittcon helps keep attendees informed of, connected to, and up to date on ongoing scientific findings and new instrumentation.

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Handbook of Sealant Technology

Handbook of Sealant Technology

The Handbook of Sealant Technology provides an in-depth examination of sealants, reviewing their historical developments and fundamentals, adhesion theories and properties, and today’s wide range of applications.

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