Cargill and ASU are teaming up to explore how Cargill™ Priamine™ — a biobased dimer diamine used in high-performance adhesives — can enhance the speed, efficiency, and sustainability of semiconductor technology.
LG Chem has co-developed a high-performance silver paste with Japan’s Noritake that is designed specifically for bonding silicon carbide (SiC) chips to substrates in automotive power semiconductors.
The IPC APEX EXPO 2026, a leading event in the electronics manufacturing industry, is now accepting abstracts for technical papers, posters, and professional development courses.
As a technical solution provider, Bodo Möller Chemie Group supplies manufacturers throughout the entire automotive value chain with high-performance adhesives and sealants.
Avery Dennison Performance Tapes recently introduced a new EV Battery Venting Materials Portfolio to help counter the risk of thermal runaway and increase safety in EV batteries.