Articles Tagged with ''adhesives in electrical/electronic''

Henkel reports that the expansion enhances the facility’s role as the company’s North American flagship for thermal management and adhesives solutions.

The innovative silicone gel resists temperatures up to 180 °C for Generation 7 IGBT modules.

Wevo Chemie is strengthening its presence in India’s high-growth market for polyurethane solutions with the founding of WEVO Chemical India Private Limited, headquartered in Gurugram, southwest of New Delhi. 

With up to 130% elongation at break and excellent adhesion to metals and plastics, Vitralit UD 8060 F offers soft, stress-absorbing bonds for demanding applications.

Parker Chomerics THERM-A-GAP CIP 35E is a two-component dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity. 

This acrylate-based instant adhesive offers fast-curing time and high adhesive strength on metals and thermoplastics such as ABS and PVC. 

Cargill and ASU are teaming up to explore how Cargill™ Priamine™ — a biobased dimer diamine used in high-performance adhesives — can enhance the speed, efficiency, and sustainability of semiconductor technology.

Berquist Liqui Form TLF 6500 CGel-SF is an upgraded thermal curable gel designed to push the envelope of ADAS applications.

LG Chem has co-developed a high-performance silver paste with Japan’s Noritake that is designed specifically for bonding silicon carbide (SiC) chips to substrates in automotive power semiconductors. 

Meridian Adhesives Group has appointed Kevin Zhou as the new global technical director of its Electronics Division.