The IPC APEX EXPO 2026, a leading event in the electronics manufacturing industry, is now accepting abstracts for technical papers, posters, and professional development courses. Scheduled for March 14–19, 2026, at the Anaheim Convention Center in California, the event’s technical conference has been rebranded as the Advanced Electronic Packaging Conference 2026. The name change highlights the increasing integration of packaging, interconnect, and manufacturing technologies across all levels of electronics. While the conference format and scope are evolving, the trusted technical content remains — now broadened to more fully represent the entire spectrum from individual components to complete systems.

This call for technical papers, posters, and professional development courses offers a significant opportunity for professionals to showcase innovations that enhance electronics manufacturing. Topics of interest include design and simulation; materials; advanced PCB fabrication; assembly, test and manufacturing; quality, reliability and metrology; digital manufacturing; and sustainability. The highest priority will be given to abstracts that match the Advanced Electronic Packaging Conference 2026 topics list.

Key deadlines to submit:

• Technical Paper Indication of Interest: July 31, 2025
• Technical Paper Abstract: September 12, 2025
• Professional Development Course Abstract: September 19, 2025
• Poster Abstract: December 1, 2025

Abstracts for technical paper presentations, posters, and professional development courses should describe significant results from research work, highlight new techniques or materials, and discuss cutting-edge trends and challenges facing component- and subsystem-level integration. Organizers strongly recommend registering an early Indication of Interest now by entering contact information and proposed paper topic in the Oxford Abstracts system. Content should be noncommercial in nature and describe significant results from experiments, emphasize new techniques, discuss trends of interest, and contain technical and/or appropriate test results.

Selected presenters will have their work published in the official Conference Proceedings and archived online, providing long-lasting exposure to a global audience of technical leaders, decision-makers, and innovators.

For submission details and to participate in shaping the future of electronics manufacturing, visit the IPC APEX EXPO 2026 Call for Participation page.