The IPC APEX EXPO 2026, a leading event in the electronics manufacturing industry, is now accepting abstracts for technical papers, posters, and professional development courses. Scheduled for March 14–19, 2026, at the Anaheim Convention Center in California, the event’s technical conference has been rebranded as the Advanced Electronic Packaging Conference 2026. The name change highlights the increasing integration of packaging, interconnect, and manufacturing technologies across all levels of electronics. While the conference format and scope are evolving, the trusted technical content remains — now broadened to more fully represent the entire spectrum from individual components to complete systems.

This call for technical papers, posters, and professional development courses offers a significant opportunity for professionals to showcase innovations that enhance electronics manufacturing. Topics of interest include design and simulation; materials; advanced PCB fabrication; assembly, test and manufacturing; quality, reliability and metrology; digital manufacturing; and sustainability. The highest priority will be given to abstracts that match the Advanced Electronic Packaging Conference 2026 topics list.