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NewsAdhesives and Sealants TopicsAdhesive & Sealant ProductsAdhesives & Sealants HeadlinesFinished Adhesives and Sealants

LG Chem and Noritake Co-Develop Bonding Paste for Automotive Power Semiconductors

Picture of LG Chem silver bonding paste in a white container

Image courtesy of LG Chem. 

June 23, 2025

LG Chem has co-developed a high-performance silver paste with Japan’s Noritake that is designed specifically for bonding silicon carbide (SiC) chips to substrates in automotive power semiconductors. Noritake is a leading Japanese company with over 120 years of expertise in advanced ceramics, supplying grinding wheels, materials for electronic components, and kilns (thermal processing equipment) for applications in the semiconductor and automotive industries.

As automotive electrification and autonomous driving technologies experience a rising trend, the demand for power semiconductors is growing rapidly. However, traditional soldering methods, which rely on melting metals to join components, have become less effective as the operating temperatures of power devices increase. This has created a growing need for paste that can maintain stability and performance under high thermal conditions.

The silver paste, co-developed by LG Chem and Noritake, is a high-performance paste containing nano-sized silver (Ag) particles, combining LG Chem’s particle engineering technology with Noritake’s particle dispersion expertise. The two companies achieved superior heat resistance and thermal conductivity in a single formulation.

Unlike conventional silver pastes, which require cold storage and have a short storage life that complicates inventory management, the new product offers long-term stability at room temperature. This improvement enhances transportation and storage efficiency, while also extending the usable time within customer processes—ultimately reducing material loss.

Building on this successful collaboration, LG Chem and Noritake plan to pursue further joint development of next-generation materials for future automotive applications.

“Leveraging our accumulated technological expertise and advanced materials design capabilities, LG Chem has provided customized solutions across various industries, including automotive electronics,” said Shin Hak-Cheol, CEO of LG Chem. “Through our partnership with Noritake, we aim to strengthen our differentiated competitiveness in the global automotive materials market.”

Learn more about the paste at www.lgchem.com. 


KEYWORDS: adhesives in electrical/electronic bonding

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