Conductive Adhesives Target Grounding and EMI Shield Bonding Applications
Pelnox, a manufacturer and supplier of epoxy, polyurethane, silicone and conductive resin products, is evaluating conductive adhesives for ground (GND) connections, EMI shield bonding and related applications inside electronic devices. The company is testing ONE-HAND MIXING®, a mixer-integrated two-part conductive adhesive, for applications where conventional joining methods may present design challenges.
Ground connections electrically connect enclosures, shielding components, PCB ground planes, cable shields and other conductive parts. In addition to providing a current return path, grounding can support EMI/EMC performance, electrostatic discharge (ESD) protection and stable reference potential.
These connections are traditionally made using soldering, screws or studs, spring contacts, and conductive gaskets. However, smaller and lighter electronic products, increased use of plastic and plated-plastic enclosures, and heat-sensitive components such as flexible printed circuits (FPCs) and sensors can make these methods difficult to use.
Conductive adhesives can provide electrical connection and mechanical bonding without soldering heat, making them an option for some of these applications.
Pelnox reports that its evaluation identified consistency of preparation and application as an important consideration, particularly for small bonding areas. Ground connections often require small amounts of adhesive applied precisely, and variations in mixing ratio or incomplete mixing can affect contact resistance.
With ONE-HAND MIXING, resin and hardener are pre-filled in a cartridge and mixed in a static mixer during dispensing, eliminating separate weighing and manual mixing. The adhesive can be applied as dots or continuous beads and cures at room temperature.
Conductive adhesives are not suitable for every grounding application. For applications governed by product safety standards, including protective or safety grounding, conductive adhesive alone does not ensure compliance. Performance should be verified in the finished device and, where required, used with mechanical fastening or redundant grounding paths.
Application-specific testing should consider contact resistance, adhesion strength, stability under temperature, humidity and vibration, and system-level EMC performance.
Pelnox plans to continue evaluating the technology with plated-plastic housings, metal enclosures, PCB ground connections, shielding components and cable shield terminations.
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