Have you ever run your hot-melt tank above the adhesive manufacturer’s recommended operating temperature? Did someone on the line ever forget to turn the equipment off at the end of the day? What about drips on the tank lid, or that one spot on the nozzle that always seems to collect buildup?
As part of a collaborative project focusing on coatings and joining systems for lightweight materials, the U.S. Army Combat Capabilities Development Command (DEVCOM) Army Research Laboratory (ARL) tasked PPG to develop a high-strength, highly ductile structural adhesive to meet the requirements of the U.S. Department of Defense’s (DoD) test method standard MIL-PRF-32662, Tier I-III specification. MIL-PRF-32662 incorporates a decade of rigorous research efforts to statistically correlate the complex ballistic response of adhesively bonded armor assemblies to universally translatable and commercially relevant quasi-static mechanical properties.
Recent innovations in the electronics industry, such as hybrid vehicles, mobile electronic devices, medical applications, digital cameras, computers, defense telecommunications, and augmented reality headsets, touch nearly every part of our lives.
The company reports that the approximately $2.1 million investment is in response to increasing customer demand for its products.
March 25, 2021
Scott Bader recently announced that it has made a capital investment to expand production capacity for its range of Crestabond® and Crestomer®structural adhesives, Crystic® gelcoats, and formulated products.
I realize that the meter/mix equipment can be a major inconvenience. Adhesives come in two forms, namely two component or one component. Two-component adhesives are mainly epoxies, reactive acrylics, or polyurethanes.
The U.S. Partnership for Assured Electronics was established in 2020 with a mission to ensure the U.S. government has access to resilient and trusted electronics supply chains.
March 2, 2021
The U.S. Partnership for Assured Electronics (USPAE) is inviting electronics manufacturers and related companies to participate in its programs, highlighting the opportunities to collaborate with industry peers and the U.S. government.
Henkel will leverage services from NC State’s Packaging Research in Electronic Energy Systems (PREES) lab facilities as part of the agreement.
March 2, 2021
Henkel and North Carolina State University's Future Renewable Electric Energy Delivery and Management (FREEDM) Systems Engineering Research Center recently announced a new partnership agreement designed to study the impact of materials technology on power electronics applications.
With a focus on the process chain of joining/bonding by means of gluing, molding, sealing, and foaming, Bondexpo offers detailed and system solutions for present and future challenges in the field of joining and bonding a broad range of materials.