DELO: Super-Low-Temperature Curing Adhesives

Schematic illustration of a camera module: blue arrows symbolize the low-temperature curing process of new SLT adhesives (Figure: DELO).
DELO has introduced super-low-temperature (SLT) curing adhesives for consumer electronics assembly that cure at temperatures as low as 45 °C. Part of the company's DUALBOND LT family, the adhesives cure in as little as 10 minutes at 60 °C or one hour at 45 °C. In line with DELO’s dual-curing approach, the SLT adhesives combine light fixation — a brief UV or visible light exposure that locks components in place within seconds — with a subsequent low-temperature curing step that delivers full mechanical strength and long-term reliability.
Traditional heat-curing processes for consumer electronics can require temperatures of 80 °C or curing times of 90 to 120 minutes at 60°C. According to DELO, curing at 60 °C for 10 minutes can allow manufacturers to use inline heat tunnels instead of batch ovens. The company also reports that simulations showed reduced component deformation when curing at 45 °C compared with higher temperatures.
Lower curing temperatures can enable the bonding of heat-sensitive components and materials. For example, small integrated batteries can remain in an assembly during bonding, while cellulose-based substrates can be used in applications where higher curing temperatures previously presented challenges.
Learn more at delo-adhesives.com.
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