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Adhesives and Sealants TopicsEnd UserCuringFinished Adhesives and SealantsEnd User Features

Innovations in Curing Adhesives and Sealants

RadTech 2018 will include 100 presentations on the latest UV and EB technologies, as well as an exhibition.

RadTech 2018
RadTech 2018
RadTech 2018
RadTech 2018
May 1, 2018

RadTech 2018, the biennial global conference on the ultraviolet (UV) and electro-beam (EB) curing industry, will take place May 7-9 in Rosemont, Ill. The three-day conference will include more than 100 presentations detailing the latest information in UV and EB technology, including 3D printing, UV LEDs, packaging/printing, automotive markets, flooring, and more. In addition, a global market overview session will take place. In this session, representatives from leading companies will present market overview data from North America, China, and Europe.

On the show floor, some 80 exhibitors are expected to display their technologies (see Exhibiting Companies below). A new Exhibit Floor Theater will host the following presentations and panel discussions: “The Future of UVC LED,” “Innovations in 3D Printing,” “The Future of UV LED Chemistry,” “UV+EB For Food Safety,” “UV Inkjet, Electron Beam for Packaging” and “The Future of Manufacturing and Customer Use in the Automotive Industry.” Featured speakers and panelists include representatives from Nestle, PepsiCo, Ford and Formlabs.  ASI

For more information, visit www.radtech2018.com.


Schedule of Events

Sunday, May 6

Registration Express Check-In: 8 a.m.-7 p.m.

UV+EB University/Short Courses: noon-9 p.m.

Monday, May 7

Registration Express Check-In: 7 a.m.-6 p.m.

Conference Sessions: 8 a.m.-5:30 p.m.

Exhibition: 10 a.m.-6:30 p.m.

Opening Reception: 5:30-6:30 p.m.

Tuesday, May 8

Registration Express Check-In: 7 a.m.-6 p.m.

Conference Sessions: 8 a.m.-5:30 p.m.

Exhibition: 10 a.m.-6:30 p.m.

President's Reception: 5:30-6:30 p.m.

Emerging Awards Dinner: 6:30-8:30 p.m.

Wednesday, May 9

Registration Express Check-In: 7 a.m.-noon

Conference Sessions: 8 a.m.-3:15 p.m.

Exhibition: 10 a.m.-2 p.m.

Exhibiting companies

Alberdingk Boley Inc.

Allnex

American Ultraviolet

BCH

BYK USA

Carestream Contract Manufacturing

CB Mills

Changzhou Tronly New Electronic Materials Co. Ltd.

CFCM Magazine

Chitec Technology

Clearstone Technologies

Coatings World

Colorado Photopolymer Solutions

Daicel ChemTech Inc.

Digital Light Lab

Dowa

DSM

Dymax Oligomers & Coatings

Dynamic Matter LLC

EIT Instrument Markets

Energy Sciences Inc.

Evonik Corp. Coating Additives

Evonik Corp. Interface & Performance

Excelitas Technologies

GEW Inc.

Gold Array Technology Beijing LLC

GURUN

Hamamatsu Corp.

Hampford Research

Hauthaway

The Hebrew University of Jerusalem

Heraeus Noblelight America

Honle UV America

Hybrid Plastics Inc.

IGM Resins

IMI

Ink World Magazine

Innovations in Optics

International Light Technologies

IST America ITL

Jarchem Industries Inc.

Jelight Co. Inc.

Jiangsu Tetra New Material Technology Co. Ltd.

Keyland Polymer Material Sciences LLC

King Brother Chem Co. Ltd

Kopp Glass

Kowa American

Kromachem Inc.

Lambson Ltd.

LG Innotek

Melrob US Inc.

Miltec UV

Miwon North America

Moi Composites

Nagase America Corp.

Nedap Light Controls

NICHIA Corp.

PCI Magazine

Phoseon Technology

PL Industries division of Esstech Inc.

Prime Coatings

Prime UV IR Systems

Printed Electronics Now

RAHN USA Corp.

Reboot Medical

Red Spot Paint & Varnish Co.

Sartomer Americas

Sensor Electronic Technology Inc.

Shamrock Technologies

Siltech Corp.

Synasia Inc.

Taica North America Corp.

Trio Labs

The University of Iowa

Ushio America

UV+EB Technology Magazine

*as of 4/3/18

KEYWORDS: associations electron beam (EB) curing events innovation light-cure adhesives ultraviolet (UV) curing

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