Funding will be awarded to eligible Manufacturing USA institutes, a network of 14 public-private partnerships that work with academic and private sector manufacturing organizations on research and development and manufacturing skills training.
April 1, 2020
The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has opened a funding opportunity for rapid, high-impact projects that support the nation’s response to the COVID-19 pandemic.
Last year, Covestro put in place a global strategic program to establish the theme of circular economy throughout all areas of the company.
March 27, 2020
Covestro recently announced that it will take a loan with the European Investment Bank (EIB) for €225 million (approximately $243.7 million) to provide medium-term funding to strengthen its R&D work in the areas of sustainability and circular economy within the European Union (EU).
The 2020 World Adhesive and Sealant Conference (WAC2020) will provide myriad opportunities for adhesives and sealants professionals to gather and learn about the latest products and technologies that the industry has to offer.
The DOE aims to advance research and development of solar technologies that reduce the cost of solar, increase the competitiveness of American manufacturing and businesses, and improve the reliability of the grid.
February 19, 2020
The U.S. Department of Energy (DOE) recently announced up to $125.5 million in new funding to advance solar technology research.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
With a theme of “Diversification Research and Development of Advanced Materials,” the International Congress on Advanced Materials Sciences and Engineering (AMSE-2020) will include a plenary forum, 31 breakout sessions, and poster sessions covering topics ranging from semiconductor and electronic materials to nanomaterials and polymer materials.
EURADH is organized by the French adhesion division (SFA) of the French Vacuum Society (SFV), with the support of the Dechema (Germany), the Society of Adhesion and Adhesives (UK), the Portuguese Adhesion Society, De Bond voor Materialenkennis (Netherlands), Grupo Espanol de Adhesion y Adhesivos (Spain), and the Italian community of adhesion.