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PPG will collaborate with DOE’s Lawrence Livermore National Laboratory and Pacific Northwest National Laboratory to develop computer-based models of the aging characteristics of a variety of next-generation adhesives designed to join lightweight materials.
PPG recently announced that it has been selected for a U.S. Department of Energy (DOE) partnership that will use supercomputing resources to accelerate the development and testing of structural adhesives for vehicles built from lightweight materials.
Gelest, Inc. recently announced that Barry Arkles, Ph.D., founder, president, and chief technology officer, is the recipient of the American Chemical Society 2020 Frederic Stanley Kipping Award in Silicon Chemistry.
Henkel materials specialists have reportedly developed novel formulations that allow for large-scale production at high speed, reduce the risk of thermal event-related safety concerns, and enable various battery architectures.
At the 2019 Electric & Hybrid Vehicle Technology Expo, which will be held September 10-12 in Novi, Mich., Henkel reports that it will display its latest material technologies for cost-effective high-volume assembly, protection, and thermal control of next-generation electric vehicle (EV) battery systems.
Reversible adhesion inspired by the gecko has attracted attention in applications such as biomedical masks, climbing robots, transfer printing, and pressure-sensitive adhesives.
Microdispensing enables state-of-the-art manufacturing processes in industries such as electronics and increases the service life of individual components. Adhesives, sealants, potting compounds, or heat-conductive pastes can be efficiently processed in myriad applications.
Interested parties are invited to share their knowledge and innovations on a range of topics at the 2020 World Adhesive & Sealant Conference, which will be held April 20-22 in Chicago.
The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.
At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.
Covestro recently announced that it is serving as a key raw materials partner in a consortium managed by the Technical University of Denmark that is currently carrying out a research project called DURALEDGE (from durable leading edges) to investigate erosion mechanisms and develop new coatings to permanently protect rotor blades.
Dow recently announced that it is looking to encourage debate across the industry at K 2019, which will be held October 16-23, 2019 in Düsseldorf, Germany.
With 2,000 exhibitors and 30,000 attendees from 40+ vertical markets, PACK EXPO Las Vegas 2019 is reportedly the year’s biggest and most comprehensive packaging event in the world.
This course will deliver a comprehensive and highly practical formulation science platform, illustrated using case studies in reactive, hot-melt, and aqueous formulations by experts in adhesives and coatings.
Chem Show showcases the latest equipment and product technology related to the processing of fluids, powders, and gases through its free seminar program and nearly 300 exhibiting companies.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
