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The annual list from Clarivate™ identifies organizations in the global innovation landscape and measures those organizations’ consistency and scale in innovativeness.
It is the first world-scale production plant for chlorine based upon the ODC (oxygen depolarized cathode) technology invented by Covestro and its partners.
Arkema announced a partnership with the French National Center for Scientific Research (CNRS) and the Université de Haute-Alsace to inaugurate a new lab at the Mulhouse Institute of Materials Science.
The Pressure Sensitive Tape Council (PSTC) is hosting Tape Week May 8-11, 2023, at the Hilton Orlando in Orlando, Florida. The event will offer educational sessions, an exhibition, and networking opportunities.
H.B. Fuller and HSMG have partnered to pair HSMG PROTĒAN® CupKOTE™ with H.B. Fuller Swift®tak adhesives to provide a commercial-ready, poly-free, water, oil and grease barrier solution for single-use paper beverage cup manufacturers in North America.
Henkel has set a new strategic course for its corporate venture capital activities in the consumer goods business with its venturing unit, Henkel dx Ventures, which partners with start-ups for co-innovation and invests in global ventures focusing on digital commerce and sustainability.
Scientists already understood the mechanics of adhesion in gecko feet, but two academic papers published this year give a clearer picture of the molecular structures that create it.
The Adhesive and Sealant Council has planned an informative and timely program that addresses issues foremost on the minds of industry executives at its upcoming Executive Leadership Conference.
Designed for senior-level industry executives, the Adhesive and Sealant Council’s Executive Leadership Conference will take place November 1-3, 2022, at the Hilton La Jolla Torrey Pines in La Jolla, California.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
The FINAT European Label Forum offers a source of knowledge, experience, and networking that is key to the strategic success of label businesses. Read More