The facility is designed to accelerate the development of impactful and sustainable solutions, foster deeper customer collaboration, and drive Henkel’s long-term growth in the Asia-Pacific region.
The new innovation hub in Singapore will be established as a permanent location in tesa's technology network to drive customized development and scaling of removable adhesive solutions.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
Organized by Women in Chemicals, this landmark conference will offer opportunities for networking, learning, and professional development. With a diverse array of sessions, workshops, and social events, participants can expect a dynamic program designed to empower and inspire.
This annual Midwest coatings conference combines all of the high-quality technical presentations, exhibits and networking opportunities from the Coatings Trends and Technologies and Powder Coating Summit conferences into one new event. The event caters to both liquid and powder coatings formulators and manufacturers.