As part of a collaborative project focusing on coatings and joining systems for lightweight materials, the U.S. Army Combat Capabilities Development Command (DEVCOM) Army Research Laboratory (ARL) tasked PPG to develop a high-strength, highly ductile structural adhesive to meet the requirements of the U.S. Department of Defense’s (DoD) test method standard MIL-PRF-32662, Tier I-III specification. MIL-PRF-32662 incorporates a decade of rigorous research efforts to statistically correlate the complex ballistic response of adhesively bonded armor assemblies to universally translatable and commercially relevant quasi-static mechanical properties.
The expansion is the latest step in Apple's effort to build a world-class team of engineers in Munich and across Germany.
March 18, 2021
Apple recently announced that it will make Munich its European Silicon Design Center, adding hundreds of new employees and a new state-of-the-art facility focused on connectivity and wireless technologies.
The seriousness of the COVID-19 pandemic entered the consciousness of most people I know (in the U.S., anyway) in March 2020. I specifically remember circling the date on the calendar when it truly sunk in for me: March 13. What a difference a year makes.
Before 2020, I always thought it would be fascinating to live through a truly “historic” time. The massive losses of the past year—both human and economic—have cured me of that naïve perspective. However, the continued upheaval has also shown how resilient, supportive, and innovative we can be in the face of multiple crises.
IPC APEX EXPO 2021’s virtual platform will allow attendees, exhibitors, and speakers to easily navigate more than 100 technical conference sessions, professional development courses, and product demonstrations.
March 2, 2021
IPC APEX EXPO 2021 is being held virtually on March 8-12, 2021. “Given ongoing COVID-19 health and safety concerns and continued restrictions for large gatherings and events in California, it was not feasible to safely convene the nearly 9,000 expected participants at IPC APEX EXPO 2021,” said John Mitchell, IPC president and CEO. “The event will now take place in a safe, all-virtual format.”
The Start-up Connect initiative will combine the dynamism of small, agile, and innovative organizations with Arkema’s expertise in specialty materials to develop the innovations of tomorrow.
February 16, 2021
Start-up Connect, a new Arkema program, invites start-ups specializing in advanced materials from around the world to join forces with Arkema to establish a research collaboration and benefit from the group's support and technological experience.
Attendees will have opportunities to evaluate the latest technologies, connect with potential business partners, learn the latest process improvement techniques to streamline their operation, and much more.
February 12, 2021
Registration is open for the ASSEMBLY Show, which will return in person to the Donald E. Stephens Convention Center in Rosemont, Ill., October 24-26, 2021.
The awards identify impact chemistries that contribute to downstream industries’ unmet needs and technology advancements.
February 10, 2021
The Adhesive and Sealant Council (ASC) recently announced that entries are open for its annual Innovation Awards Program, which is designed to recognize innovation in adhesive and sealant product developments.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
With a focus on the process chain of joining/bonding by means of gluing, molding, sealing, and foaming, Bondexpo offers detailed and system solutions for present and future challenges in the field of joining and bonding a broad range of materials.