WEVO-CHEMIE: Potting Compound

WEVOPUR 60210 FL T is a polyurethane system from WEVO-CHEMIE GmbH that has been specially developed for highly complex multi-layer printed circuit boards (PCBs) used in modern battery management systems. Playing a crucial role in reducing the risk of failure and ensuring long-term functionality, the electronic potting compound combines electrical insulation, thermal conductivity and precisely adjusted mechanical properties. Due to its optimized rheology, it enables automated processing using the dam-and-fill method.
With a Shore hardness of D 40 to 50, WEVOPUR 60210 FL T absorbs shocks and vibrations as well as stresses caused by fluctuating temperatures. Its thermal conductivity of 0.8 W/m·K enables heat to be distributed within the potted assembly and helps reduce temperature differences between the PCB components. With this product, the risk of stress cracks and solder joint detachment is reduced. Adhesion properties also ensure a durable bond between the potting compound and the substrate and help to prevent delamination. The PU potting also ensures that the electronic components are securely fixed in place and stabilized.
The dielectric strength of more than 20 kV/mm supports electrically insulated battery management systems. Additionally, the formulation of the electronic potting compound is designed to prevent electrochemical corrosion and protect the components from moisture.
WEVOPUR 60210 FL T acts as both a barrier and a filler when applied using the “dam-and-fill” method. The flow behavior and thixotropy are specifically adjusted so that the barrier retains its shape while the filler completely wets the area to be protected without forming any air pockets. These properties enable a reliable, automated production process using standard 2K mixing and dosing systems and reduce the workload involved in material qualification, storage and process management.
Learn more at wevo-chemie.
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