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COOL-PAD™ CPR7154 is a new class of thermal interface material that reportedly dispenses like a thermal pad but performs with characteristics like that of a grease or gel when device temperatures increase to above 45°C. The material is optimized to accommodate large areas with different heights and gaps of less than 3 mil along its interfacing area. It is filled with a modified oxide mixture and is electrically insulating at normal voltage.
The material is semi-tacky on both sides for optimum thermal transfer performance. CPR7154 has high thermal conductivity and low Tgcharacteristics that can impose minimum thermal stress on bonded parts during thermal cycling or shock testing. While it has some intrinsic tack strength, the material is not designed for bonding. A mechanical fastener must be used to provide assembly integrity.
For more information, visit www.aitechnology.com.