A new generation of flip-chip underfill solution is now available that combines a Tg of > 240°C and novel stress absorbing capabilities to reportedly allow long-term reliability of large area flip-chip devices. MC7885-UFS underfill adhesive can fill under large area chips and reportedly cures without voids and internal stresses.

The paste can underfill large area flip-chip components to provide a thermal interface, allowing high-power devices to dissipate heat to both sides of the package. The material is designed for use in both chip-on-board underfill and standard flip-chip underfill component applications to reduce stress. It can withstand temperatures up to 350ºC without thermal degradation.

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