This company has released a new electrically and thermally conductive 20-micron wafer level die-attach film (DAF). ESP8660-HK can be produced in wafer-shape die-cut format and pre-laminated on dicing tape (DDAF) format up to widths of 450 mm and lengths of 100 m. The film was developed for high glass-transition requirements to facilitate faster wire bonding at temperatures as high as 250°C. It is molecularly engineered to reduce stress and improve the reliability of multi-chip module (MCM) and system-in-package (SIP) devices.

For more information, visit