The latest in a series of recent materials innovation successes, Ablestik C100 series conductive die-attach films, is now available. Available in two formulations, Ablestik C130 and C115 supplied in 30 and 15 micron thicknesses, respectively, the films can enable leadframe package manufacturers to realize the advantages film-based products provide over traditional paste die-attach products. Benefits reportedly include the elimination of die tilt, the ability to process thinner die and the facilitation of greater bondline control-all of which allow for improved processability, higher yields, and better long-term reliability.

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