LOCTITE ABLESTIK CDF 200P is a new pre-cut film that is available for 6- or 8-in. wafers. Reportedly compatible with lamination equipment commonly used in the field, the film offers a lamination temperature of 65°C. According to the company, it complies with most existing equipment and processes for both lamination and backgrinding. In addition, its two-in-one dicing tape and die-attach film combination can streamline manufacturing by facilitating an inline process for thin wafers and a single lamination process in one combined step.

For additional information, visit www.henkel.com/electronics.