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AHEAD is DuPont’s Accelerating Hybrid-Electric Autonomous Driving initiative, which combines adhesives, high-performance elastomers, electronic materials, and high-performance fibers and films.
DuPont recently announced that it will highlight alternative drivetrain technologies from its AHEAD initiative at CES, which will be held January 7-10 in Las Vegas, Nev.
Henkel’s presence at the IMAPS symposium, which is taking place September 30-October 3 in Boston, Mass., is reportedly centering on its expertise at the wafer and board level, with particular emphasis on solutions for aerospace electronics.
Six tamper-evident label constructions are reportedly ideal for packaging closures and destructible labeling, while 13 facestock and adhesive combinations that prevent material lifting and adhere to small diameter curves.
This acquisition would reportedly enable Bostik to broaden its offering of solvent-free thermobonding solutions earmarked for many fast-growing industrial applications in the automotive, construction, textile, and medical markets.
These polyolefin elastomers are reportedly commonly used in applications for automotive, footwear, wire, cable, foam, multi-layered films, laminating films, food packing films, and films for industrial use.
FLEXcon Co., Inc. recently announced that it has acquired a narrow web embossing machine with a portion of the funds received from the Massachusetts Manufacturing Innovation Initiative (M2I2) grant awarded to Carpe Diem Technologies.
Many adhesive film manufacturers are shifting their manufacturing activities to emerging economies including China, India, Indonesia, Taiwan, and the Philippines.
