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The new portfolio is the result of a supply agreement between Channeled Resources Group and a major U.S. substrate manufacturer that gives the company access to a large volume of off-cuts of premium core and specialty products.
According to Toyochem, TSS510-HF addresses the needs of today’s electronics designers for improved shielding performance for the transmission of high-frequency signals and for high flexibility so circuits do not break when bent.
Toyochem Co., Ltd., a member of the Toyo Ink Group, has launched a flexible electromagnetic interference (EMI) shielding film, LIOELM TSS510-HF, designed to meet the performance requirements of 5G flexible printed circuits (FPCs).
Adhesive manufacturers are developing new technologies that converters can present to their packaged goods customers and enable them to capture more market share.
Pressure-sensitive adhesives (PSAs) continue to gain traction in the broad category of packaging. PSAs are rapidly changing the way goods are packaged and delivered to consumers in traditional retail and via ecommerce.
I profoundly hope that you are reading this issue of ASI in good health and from the safety of your own home. The last few weeks have seen an unprecedented global response to the threat of COVID-19—from school, restaurant, and facility closings to innumerable event postponements and cancellations.
The $20 million expansion, which will be operational in 2020 across Berry’s U.S. network of breathable film-producing plants, represents the first of a three-phase Sof-Flex film expansion plan.
After consolidating the roll label business of LINTEC with that of Mactac, 2019 marked the first full year of combined sales activity for the new Mactac LINTEC products.
AHEAD is DuPont’s Accelerating Hybrid-Electric Autonomous Driving initiative, which combines adhesives, high-performance elastomers, electronic materials, and high-performance fibers and films.
DuPont recently announced that it will highlight alternative drivetrain technologies from its AHEAD initiative at CES, which will be held January 7-10 in Las Vegas, Nev.
Henkel’s presence at the IMAPS symposium, which is taking place September 30-October 3 in Boston, Mass., is reportedly centering on its expertise at the wafer and board level, with particular emphasis on solutions for aerospace electronics.
