Ultraviolet (UV) light-emitting diode (LED) curing offers many benefits for bonding and coating applications in the touchscreen manufacturing segment. It provides a more consistent and reliable process without damaging or discoloring heat-sensitive components.
With increasing consumer demand for convenience comes greater demand for high performance standards and increased sustainability. The packaging industry is no stranger to these trends taking place with consumer products across the world
Hot-melt pressure-sensitive adhesives (HMPSAs) have become important in the manufacture of pressure-sensitive labels. Several types of styrenic block copolymers (SBCs) are used to formulate HMPSA adhesives.
The current laminating industry mindset is to simply try anything. Many manufacturers have started to realize that creative combinations of unexpected substrates might fill untapped demand for finished products that look and feel novel, are extra sturdy, or display other desirable properties that are unattainable with standard materials.
Pressure-sensitive adhesives professionals from around the world will convene May 11-15 for this key tape industry event.
May 1, 2015
From May 11-15, tape professionals from around the world will come together in Baltimore for the Pressure Sensitive Tape Council’s Tape Summit 2015. The industry-focused event will provide segmented and flexible learning options to help attendees formulate the most effective knowledge-building experience possible.