Underfill 25 is a new, single-component system formulated for fast flow and snap-cure, flip-chip encapsulant applications. The ultra-high-purity epoxy fills a 1.5-mil aperture in under three seconds and cures in less than 10 minutes above 150degC. Underfill 25 is suitable for wire-bonded or flip-chip die applications as well as direct-die encapsulation of a range of assemblies on most board substrates. With essentially no ionic extractables, Underfill 25 provides excellent temperature and chemical resistance for the most demanding microelectronic applications. Circle No. 113