This company offers the CHIPSHEILD 2000 line of single-component, UV- and thermally activated epoxy products. Designed for use as encapsulants, coatings and no-flow underfills, the products represent the next generation of polymeric materials for the assembly of electronic devices. The products in the line vary in areas of viscosity, Tg, hardness, thermal conductivity and CTE. All of the products are 100-percent epoxy systems that contain no monomer or solvents, have no odor, and exhibit extremely low shrinkage and outgassing upon cure.