Adhesives Mag logo
search
cart
facebook twitter linkedin youtube
  • Sign In
  • Create Account
  • Sign Out
  • My Account
Adhesives Mag logo
  • NEW PRODUCTS
  • NEWS
    • Adhesives & Sealants Headlines
    • Mergers/Acquisitions
    • Events Calendar
    • Market Trends
  • TOPICS
    • Finished Adhesives and Sealants
    • Pressure-Sensitive Adhesives (PSAs)
    • Coatings
    • Raw Materials and Chemicals
    • Materials Handling/Processing
    • Meter/Mix/Dispense
    • Curing
    • Testing/Quality Control
    • Packaging of Adhesives & Sealants
    • Converting/Packaging
    • Composites
    • Sustainability
  • COLUMNS
    • European Perspectives
    • Strategic Solutions
    • Supply Chain Strategies
    • Tape Talk
  • TOP 20
  • MULTIMEDIA
    • Videos
    • Podcasts
    • Webinars
    • eBooks
  • EXPLORE
    • Adhesives in Action
    • Blog
    • ASI Store
    • Industry Links
    • Market Research
    • Classifieds
  • DIRECTORIES
    • Buyers' Guide
    • Global Adhesives & Sealants Directory
    • Raw Materials, Chemicals, Polymers and Additives Handbook
    • Equipment Handbook
    • Distributor Directory
  • EMAGAZINE
    • EMAGAZINE
    • ARCHIVE ISSUES
    • ADVERTISE
      • Custom Content & Marketing Services
    • CONTACT
  • SIGN UP!
Adhesive & Sealant Products

3M: Wafer Backgrinding System

August 2, 2004
3M has announced the introduction of the 3M Wafer Support System for ultra-thin semiconductor wafer backgrinding. An alternative to conventional tape process for backgrinding, the new system is capable of producing wafers as thin as 20 microns. This approach allows semiconductor manufacturers to use their existing grinding equipment to produce thinner wafers at faster grinding speeds with increased yields. Developed in Japan by the laboratories of Sumitomo 3M, the 3M Wafer Support System includes both equipment and consumables for a comprehensive approach to wafer backgrinding support challenges. The 3M equipment includes a wafer mounter to attach the wafer to the glass plate with liquid adhesive, a wafer demounter to separate the glass and adhesive from the wafer after the backgrinding process, and a glass cleaner/coater. The consumable materials include 3M ultra clean UV curable spin-on adhesive and a light-to-heat conversion (LTHC) coating. The LTHC layer enables separation of the adhesive from the glass after the backgrinding process. The system provides manufacturers with flexibility and the ability to use their existing backgrinding equipment to achieve outstanding results.

For more information, visit http://www.3M.com/electronicmaterials or call (800) 251-8634.

Share This Story

Looking for a reprint of this article?
From high-res PDFs to custom plaques, order your copy today!

Recommended Content

JOIN TODAY
to unlock your recommendations.

Already have an account? Sign In

  • mouse in hole

    Using Foam Sealants for Pest Prevention

    According to the National Pest Management Association,...
    Adhesives and Sealants Topics
    By: Kevin Corcoran
  • linked network nodes

    Using the Power of AI for Adhesive and Sealant Formulation

    With the help of software solutions, adhesive formulators...
    Adhesives and Sealants Topics
    By: Karen Parker
  • top20-hero.jpg

    2024 ASI Top 20: Leading Global Manufacturers of Adhesives and Sealants

    ASI's annual ranking of the top 20 global adhesive and...
    Finished Adhesives and Sealants
Subscribe For Free!
  • eMagazine Issues
  • eNewsletter
  • Online Registration
  • Manage My Preferences
  • Subscription Customer Service

More Videos

Popular Stories

Picture of Noelle Sieradzki

Mactac Announces Changes to Leadership Team

Picture of three men and one woman cutting a ribbon

H.B. Fuller Opens Adhesives and Sealants Facility in UAE

Picture of white beads of hot-melt adhesives

Henkel and Sasol Collaboration Helps Deliver Adhesives with Lower Carbon Footprint

ASI Top 20 website

Events

January 1, 2030

Webinar Sponsorship Information

For webinar sponsorship information, visit www.bnpevents.com/webinars or email webinars@bnpmedia.com.

View All Submit An Event

Products

Structural Adhesives: Properties, Characterization and Applications

Structural Adhesives: Properties, Characterization and Applications

See More Products

ASI CASE EBOOK

Related Articles

  • Picture of a roll of electrically conductive double-sided tape 5113DFT 50

    3M: Electrically Conductive PSA Tapes

    See More
  • Picture of tape being pulled off a surface revealing a white line on blue background

    3M: Painter’s Tape

    See More
  • Picture of a round cylinder delivery system

    3M: Water-Based Pressure-Sensitive Adhesive

    See More
×

Keep the info flowing with our eNewsletters!

Get the latest industry updates tailored your way.

JOIN TODAY!
  • RESOURCES
    • Advertise
    • Contact Us
    • Directories
    • Store
    • Want More
  • SIGN UP TODAY
    • Create Account
    • eMagazine
    • eNewsletters
    • Customer Service
    • Manage Preferences
  • SERVICES
    • Marketing Services
    • Reprints
    • Market Research
    • List Rental
    • Survey & Sample
  • STAY CONNECTED
    • LinkedIn
    • Facebook
    • Youtube
    • X (Twitter)
  • PRIVACY
    • PRIVACY POLICY
    • TERMS & CONDITIONS
    • DO NOT SELL MY PERSONAL INFORMATION
    • PRIVACY REQUEST
    • ACCESSIBILITY

Copyright ©2025. All Rights Reserved BNP Media.

Design, CMS, Hosting & Web Development :: ePublishing