The electronics group of Henkel has announced the availability of Loctite 3629, a low temperature-cure epoxy adhesive. The new material is particularly well suited for high-speed dispensing on a range of industry standard machines, including ProFlow cassettes for printing. Designed to meet the needs of the world's leading consumer electronics companies, Loctite 3629 has been successfully tested in lead-free production environments. Its low temperature cure requirement makes it ideal for applications where heat-sensitive materials, such as Light Emitting Diodes (LED) and FR2 boards, need to be bonded prior to wave soldering. Lower-curing oven temperatures required for Loctite 3629 also offer cost savings through reduced energy use.

For more information, visit http://www.henkel.com/electronics .