A new low-temperature, snap-cure, electrically conductive adhesive from Emerson & Cuming enables the rapid assembly of low cost RFID tags. Emerson & Cuming's XCE 3112 snap cures in seconds, thereby allowing RFID tag production at line speeds of several hundred feet per minute and minimizing the need for expensive cure ovens. The XCE 3112 also cures at temperatures of 110 degrees C or less, thus making it compatible with low cost temperature-sensitive substrates. Because the XCE 3112 maintains superior processing consistency at room temperature over one day, RFID tag assemblers are able to forgo cleaning and save valuable production time and materials. In addition, this adhesive also provides excellent contact resistance stability and RF performance on silver-ink based die straps and antennas.

For more information, visit http://www.emersoncuming.com or call (800) 832-4929.