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Henkel Loctite Introduces No-Clean Sustained Activity Liquid Flux
December 11, 2003
Henkel Loctite Corp. has introduced Loctite Multicore MFR301, a no-clean sustained activity liquid flux designed for wave soldering PCBs, especially those with copper substrates. This product is ideal for dual wave processing. High activity MFR301 provides enhanced wetting characteristics, a wide processing window, and excellent solderability on all substrates, especially copper. The product's rosin/solvent synergism ensures optimum drainage behavior at the exit of the wave, minimizing bridging, spiking, and mid-pad solder balling. It leaves a thin protective coating of rosin on soldered PCBs and leaves them dry to the touch with a slight rosinous luster. MFR301 is a solvent-based rosin liquid flux that passes J-STD-004 SIR and Bellcore electromigration tests.