Epoxies Etc. has developed a flexible polyurethane potting and encapsulating resin system. The 20-2353 has been developed to protect delicate and sensitive electronic surface mount components. This soft polyurethane does not impart any stress on components during cure or when thermally cycled in electronics assemblies. The system is also suggested to use for continuous exposure in wet environments. It does not absorb any moisture and will insulate electronic systems in damp or wet applications. Another benefit to using the system is its ability to maintain flexibility down to -70 degrees C.

Samples are available and may be requested at http://www.epoxies.com .