Following on the heels of several innovative solder material introductions, the electronic group of Henkel has launched its latest lead-free solder paste, Multicore WS300, a high-activity, water-washable material with superior cleaning characteristics suitable for fine-pitch, high-speed printing applications. Multicore WS300 exhibits excellent print definition with long open- and abandon-time capabilities. The product's high activity flux offers excellent wetting to a wide range of surface finishes and provides an exceptional reflow process window. In addition, the material is highly resistant to humidity and slump, and is formulated to minimize any defects due to voiding. Other benefits unique to WS300 include no visible residue on PCBs washed up to three days after being reflowed and superior slump resistance resulting in decreased defects due to bridging.

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