HENKEL: Low-Pressure Molding Materials for Medical Electronics
Henkel has introduced three new low-pressure molding (LPM) materials designed to seal and protect medical devices from moisture, temperature extremes, chemicals, vibration, impact, and other environmental concerns. Using a gentle, low-pressure process, Loctite PA 6732, Loctite PA 6682, and Loctite PA 6951 completely encapsulate medical devices such as catheters, tube sets, connectors, and surgical tools, as well as sensors and switches used in medical diagnostic and monitoring equipment. All three LPM products are tested to Henkel’s protocols based on ISO 10993 biocompatibility standards, including skin sensitization, with certificates available on request.
According to Henkel, LPM hot melts completely replace thermoplastic housings and allow manufacturers to produce complex and intricate assemblies by customizing part geometry, surface texture, color, and opacity. These materials form an adhesive bond with the entire component being encapsulated, becoming part of the component’s three-dimensional form and creating a water-tight, chemically resistant seal. The cost-effective LPM process involves three steps: placing the bare component into a custom mold set, heating the polyamide material and injecting it at low pressure into the mold, and allowing the material to cool rapidly for 10-50 seconds before removing the newly encased and bonded component for immediate use.