Phenolic resins have been a crucial part of solventborne polychloroprene adhesives for more than 50 years, and provide performance enhancements that allow these adhesives to be used in very demanding applications. They are made by reacting a phenolic resin with magnesium oxide to form a metal resinate, and they are commonly referred to as “contact cements.”
tags that do not contain a silicon chip are called chipless tags. These
chipless tags could eventually be printed directly on products and packaging
for 1¢. Far more versatile and reliable, the tags could replace 10 trillion
barcodes per year. This article reports some of the findings from a new study
on the topic.
Silicones used in adhesive and sealant applications can provide good bonding to substrates without the use of primers or surface modification techniques, such as corona, flame and plasma treatments; but some situations require the use of these additional components and/or processing steps to significantly boost adhesion to substrate surfaces.
is the first of two articles addressing the role that low-molecular-weight
polyolefins and wax additives have in the formulation and performance of
hot-melt adhesives. This part examines wax additives available to the
formulator; their composition, characteristics, and manufacture; and general
information about their use. Part two will address specific characteristics of
various types of polyolefins and their role in hot-melt adhesives, including