Bodo Möller and Henkel Expand Partnership to Improve Thermal Interface Materials
With the aim of consolidating their positions on the market, Bodo Möller Chemie Group and Henkel Adhesive Technologies added Switzerland to their collaboration. This expanded partnership centers on thermal interface materials (TIMs). Henkel’s Bergquist® thermal management materials are used to conduct heat away from power electronics, ensuring electronic components remain efficient and work reliably for a long time.
Electronic components, such as processors, generate a great deal of heat. With an extremely low thermal conductivity of 0.025 W/mK, air is one of the least efficient heat conductors. TIMs help dissipate heat from components efficiently, preventing overheating, which could impair performance or shorten component lifespans. TIMs also smooth out any uneven surfaces, tolerance deviations or roughness to create an optimal contact surface reducing thermal resistance and enhancing heat transfer.