Bostik Relaunches Thermelt to Celebrate 40 Years of Innovation
Bostik’s Thermelt®hot melt polyamide range is continuously improved to be relevant for customers as they face sustainability challenges posed by modern manufacturing processes. Made predominantly from renewable raw materials, Thermelt offers easy processing at low pressure and low temperatures, and facilitates disassembly at the end of a product’s lifecycle. This results in less waste and increased opportunities for component recycling.
Thermelt is a non-reactive, solvent-free and bio-based adhesive, consisting of rapeseed and castor bean derivatives. It is designed for many manufacturing applications, from assembly processes in the shoe industry to Low Pressure Molding (LPM) applications used in the electronic and automotive component manufacturing sectors. It is increasingly being used in new and emerging technologies in agriculture, electric vehicles, and batteries.