Mereco Technologies Group Companies, and its operating units Metachem Resins Corp. (MERECO) and DMS, has developed a new, thermally conductive silicone RTV specifically designed for heat-transfer applications in the electronics industry. Mereco Metasil 5060 is ideal for transferring heat from hot devices to heat sinks, PC boards, metal enclosures, backplanes, or chassis. It is ideally suited for the potting and encapsulating of high efficiency dc/dc converters and power supplies. "Metasil 5060 is an efficient thermal connection from the device surface to the initial heat sink and on to the ambient environment," says Philip M. Papoojian, president and COO of Mereco. "It combines the natural high-temperature and flexible properties of silicone with ease of cure and application." Metasil 5060 is a 1:1 mix ratio RTV that cures at room temperature in 24-48 hours and can be heat accelerated to cure in 2 hours at 65 degrees C. It is supplied in pint, quart, 2-quart and 2-gal kits, as well as 50ml, 200ml, and 400ml dual cartridges.

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