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MASTER BOND INTRODUCES NEW THERMALLY CONDUCTIVE ADHESIVE
March 1, 2004
Master Bond EP21AO is a two-component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, NJ, this compound is extremely versatile and will adhere well to a variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage and superb dimensional stability. It also exhibits superior durability and chemical resistance. EP21AO is easy to apply and is a self-leveling paste. It is 100 percent reactive and does not contain any solvents or volatiles. It has a thermal conductivity of 10BTU/in/ft2/hr/0F and a dielectric strength of >400 volts/mil. Its volume resistivity is >1093 ohm cm. EP21AO has a shore D hardness of >85 and a tensile strength of 5,000 psi. Service operating temperature range is -600F to +2500F. EP21AO is available for use in pint, quart, gallon and 5-gallon container kits.