Adhesives Mag logo
search
cart
facebook twitter linkedin youtube
  • Sign In
  • Create Account
  • Sign Out
  • My Account
Adhesives Mag logo
  • NEW PRODUCTS
  • NEWS
    • Adhesives & Sealants Headlines
    • Mergers/Acquisitions
    • Market Trends
    • TOP 20
  • TOPICS
    • Finished Adhesives and Sealants
    • Pressure-Sensitive Adhesives (PSAs)
    • Coatings
    • Raw Materials and Chemicals
    • Materials Handling/Processing
    • Meter/Mix/Dispense
    • Curing
    • Testing/Quality Control
    • Packaging of Adhesives & Sealants
    • Converting/Packaging
    • Composites
    • Sustainability
  • EVENTS
    • MAX
    • Events Calendar
  • COLUMNS
    • European Perspectives
    • Strategic Solutions
    • Supply Chain Strategies
    • Tape Talk
  • MULTIMEDIA
    • Videos
    • Podcasts
    • Webinars
    • eBooks
  • EXPLORE
    • Adhesives in Action
    • Blog
    • ASI Store
    • Industry Links
    • Market Research
    • Classifieds
  • DIRECTORIES
    • Buyers' Guide
    • Global Adhesives & Sealants Directory
    • Raw Materials, Chemicals, Polymers and Additives Handbook
    • Equipment Handbook
    • Distributor Directory
  • EMAGAZINE
    • EMAGAZINE
    • ARCHIVE ISSUES
    • ADVERTISE
      • Custom Content & Marketing Services
    • CONTACT
  • SIGN UP!
Adhesives & Sealants Headlines

ASYMTEK AND COOKSON WORK TOGETHER ON JETTING UNDERFILL PROJECT

May 1, 2004
To obtain optimal process solutions for their customers, Asymtek has teamed with Cookson Electronics' Semiconductor Products Division on a new project to jet underfill. Cookson visited Asymtek's application labs to test their fluid materials on Asymtek's X-1000 Series, configured with the new DJ-9000 DispenseJet. "Many of our customers use Asymtek's technology," explains Mandar Painaik, Technical Services Engineer at Cookson Materials group. "We wanted to learn about Asymtek's equipment so we can recommend the best materials for our customers." This collaboration enables the investigation of new and innovative jetting methods and material optimization. The two companies will work together as a part of Asymtek's "Win3" program, in which key fluid formulators, technology institutes and equipment suppliers join together for the benefit of customers, each other and the industry as a whole. One common customer uses Asymtek's Axiom and Millenium platforms with the DispenseJet and DP-3000 pumps for dispensing underfills. A die placement machine, reflow oven and batch oven are in line with the dispensing equipment. The customer reported better dispense volume control with Asymtek's jetting technology and Cookson's Staychip 3082 underfill material.

For more information, visit http://www.asymtek.com or http://www.cooksonsemi.com .

Share This Story

Looking for a reprint of this article?
From high-res PDFs to custom plaques, order your copy today!

Recommended Content

JOIN TODAY
to unlock your recommendations.

Already have an account? Sign In

  • mouse in hole

    Using Foam Sealants for Pest Prevention

    According to the National Pest Management Association,...
    Adhesives and Sealants Topics
    By: Kevin Corcoran
  • linked network nodes

    Using the Power of AI for Adhesive and Sealant Formulation

    With the help of software solutions, adhesive formulators...
    Finished Adhesives and Sealants
    By: Karen Parker
  • top20-hero.jpg

    2024 ASI Top 20: Leading Global Manufacturers of Adhesives and Sealants

    ASI's annual ranking of the top 20 global adhesive and...
    Pressure-Sensitive Adhesives (PSAs)
Manage My Account
  • eMagazine Issues
  • eNewsletter
  • Online Registration
  • Manage My Preferences
  • Subscription Customer Service

More Videos

Popular Stories

ASI top 20 global manufacturers

2025 ASI Top 20: Leading Global Adhesives and Sealants Manufacturers

Image of scrabble pieces with pictures of people

Sika Purchases Construction Chemicals Company in Qatar

image of a graph representing markets

H.B. Fuller Reports Results for Second Quarter and Updates 2025 Guidance

ASI Top 20 website

Events

January 1, 2030

Webinar Sponsorship Information

For webinar sponsorship information, visit www.bnpevents.com/webinars or email webinars@bnpmedia.com.

View All Submit An Event

Products

Structural Adhesives: Properties, Characterization and Applications

Structural Adhesives: Properties, Characterization and Applications

See More Products

ASI CASE EBOOK

Related Articles

  • INDA and NCSU Offers Bonding Fundamentals Course

    See More
  • CILS Ltd. Launches Barcode Bureau Division

    See More
  • Nordson Announces Partnership with Henkel and Aztek

    See More
×

Keep the info flowing with our eNewsletters!

Get the latest industry updates tailored your way.

JOIN TODAY!
  • RESOURCES
    • Advertise
    • Contact Us
    • Directories
    • Store
    • Want More
  • SIGN UP TODAY
    • Create Account
    • eMagazine
    • eNewsletters
    • Customer Service
    • Manage Preferences
  • SERVICES
    • Marketing Services
    • Reprints
    • Market Research
    • List Rental
    • Survey & Sample
  • STAY CONNECTED
    • LinkedIn
    • Facebook
    • Youtube
    • X (Twitter)
  • PRIVACY
    • PRIVACY POLICY
    • TERMS & CONDITIONS
    • DO NOT SELL MY PERSONAL INFORMATION
    • PRIVACY REQUEST
    • ACCESSIBILITY

Copyright ©2025. All Rights Reserved BNP Media.

Design, CMS, Hosting & Web Development :: ePublishing