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MASTER BOND: Epoxy Resin System
November 1, 2004
Master Bond's newly developed flexible two-component epoxy resin system EP21LV (3/5) has obtained full USP Class VI Certification for the assembly of disposable and reusable medical devices. This unique flexible epoxy resin compound is 100% reactive and does not contain any solvents or other volatile ingredients. It cures readily at ambient temperature or more quickly at moderately elevated temperatures. The cured flexible polymer compound exhibits attractive physical strength properties, exceptional toughness and superior resistance to vibration, impact, and thermal shock. Master Bond EP21LV (3/5) polymer system has excellent chemical resistance, including exposure to many sterilants, and also outstanding electrical insulation characteristics. The service temperature range extends from as low as -80 degrees F to above 250 degrees F.