IRphotonics has announced the opening of its first Application Engineering Center dedicated to the development and optimization of heating and adhesive curing processes for its growing customer base. The expansion is in response to increasing interest in the thermal spot curing system developed by IRphotonics as an inline portable heat source for the localized heating of bonded assemblies and curing of adhesives.
Engineering team, composed of engineers with post-graduate research and
practical experience with materials and heating processes, works closely with
clients from various industries to develop optimal curing processes and achieve
best-in-class quality and productivity. A range of services including degree of
cure, characterization and cure optimization can be performed for a variety of
"Our new Application
Engineering team will assist clients optimizing their curing processes by
allowing them to benefit from our unique thermal spot curing technology,” said
Ruben Burga, vice president of IRphotonics. “The iCure system has been designed
to overcome the limitations of thermal oven and UV curing, and to offer more
flexibility to process engineers. We look forward to working with a growing
number of partners to help them solve their process challenges."
For more information, visitwww.icure-irphotonics.com.
IRphotonics Opens Application Center (10/20/09)
October 20, 2009