NORDSON ASYMTEK: Flux Jetting System
"Today's flip chip devices with dense arrays of small solder or copper bumps make jetting preferable to stencil printing and dipping," said Steve Adamson, Nordson ASYMTEK's semiconductor specialist. "For example, the dipping process performed in component placement equipment is difficult to control for flux coatings below 25 microns. Too much flux can impede underfill flow; too little flux can result in insufficient soldering."
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