The new 109-12 thermally conductive low-stress epoxy was formulated to be used in manufacturing computer components and LEDs. The material is a reportedly highly effective thermal adhesive to interface between a heat-producing component and a heat-sink. The epoxy has low viscosity, which reduces the amount of air entrapment introduced in the component interface during application. This also allows a minimal amount of the product to be applied, keeping thermal resistance as low as possible. A one-component product, the epoxy exhibits minimal shrinkage during curing.

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