A new potting, encapsulating and casting resin is now available. 20-2125 is a two-component, low-viscosity, room-temperature curing system that can cushion and protect sensitive electronic components. The material reportedly imparts very little stress on components during cure or thermal cycling due to its low durometer.
For additional details, call (800) 376-9437 or visit
EPOXIES, ETC.: Potting Compound
January 19, 2011