EPM1-2493 is a low-viscosity, low-modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk. Offering bond lines as thin as 5 microns, the elastomer can be used to adhere materials with differing coefficients of thermal expansion (CTE) for stress reduction during thermal cycling.

A low-volatility elastomer, EPM1-2493 can reportedly reduce or prevent contamination of electronic device components used in applications exposed to high heat, such as solder reflow at 260°C. The elastomer can adhere well to aluminum, and its adhesive strength can be improved with the use of a primer, achieving average lap shear values of 120 psi (0.8 MPa).

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