This company has developed Continuous Path motion control software for jetting underfill for flip chips. The software reportedly optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head can maintain a continuous speed and direction throughout the process.

The Continuous Path can increase UPH even when compared to underfill methods that don’t include backtracking because stop-and-go movements between the die are eliminated. The software can reportedly save 23% dispensing cycle time at 9 mg/sec flow rate depending on actual die layout, dispensing conditions, flow rate, and other factors.

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