This company has released three new products to its line of benzoxazine resins, as well as a new high-temperature epoxy adhesive. The new resins reportedly exhibit viscosity and out-of-autoclave curing profiles that can provide for faster, easier processing to increase fabricating productivity. The products offer high modulus, excellent chemical and corrosion resistance, and the ability to perform at elevated temperatures and under humid conditions over extended periods.

XU 35500 benzoxazine is a reactive diluent designed to reduce the viscosity of benzoxazines and other resin formulations to facilitate improved handling and out-of-autoclave processing. The diluent also reportedly reduces surface tension and improves wettability of resin systems, resulting in higher quality composite parts.

XU 35610 benzoxazine resin is a bisphenol-A-based thermoset system that reportedly produces dimensionally stable, virtually void-free composites. The resin has a glass-transition temperature (Tg) of 320°F (160°C). The high modulus material is reportedly stiffer than epoxy resins with a flexural and tensile moduli > 5,000 MPa, and has excellent electrical properties.

XU 35910 benzoxazine is a formulated thiodiphenol-based resin that can produce a high flexural modulus (4,500 MPa) and high Tg. The resin is designed for lower temperature curing.

Epibond® 300 A/B epoxy adhesive is a high-strength liquid shim adhesive for aerospace and industrial applications that use metals, composites, and dissimilar substrates. The adhesive reportedly attains handling strength in less than four hours at room temperature, eliminating the need for oven or autoclave curing.

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