I’m pleased to present our annual “Raw Materials and Chemicals Overview” in this issue. This annual feature takes the pulse of some commonly used raw materials and additives for the formulation of adhesives and sealants. For even more details, be sure to check out the online version at www.adhesivesmag.com for information not included in print.

Speaking of formulation, an article beginning on p. 24 explores a new waterborne technology. With excellent adhesion properties and high-temperature performance, it has applications in the specialty tape market with emulsion technology. Read “Waterborne Acrylic PSA Technology with High-Temperature Performance” for more.

The use of adhesives in the transportation sector continues to grow. The market for adhesives in automotive applications is currently estimated to be worth $4.33 billion in 2017; it is forecast to reach $7 billion by 2022, growing at a compound annual growth rate (CAGR) of 10.1%. Flip to p. 29 for more.

For a real-word application of these adhesives, check out “Sealing Solution for Electric Vehicles” on p. 36. “Battery packs for electric vehicles face many of the same challenges that the vehicles themselves must overcome,” writes Christophe Van Herreweghe, global marketing manager of body and exteriors at Dow Automotive. He says adhesives are already onboard to address these issues, and more.

    And beginning on p. 30, we look at how a team of 16 undergraduate and graduate engineering students built an all-composite C-Class racing hydrofoil catamaran using Scott Bader structural adhesives.

Also this month, we say goodbye to a columnist and friend. Jeff Dormish has penned the “Q&A About Polyurethanes” column since before Bayer was Covestro.


Teresa McPherson is Editor of ASI magazine. If you wish to send a letter to the editor, please email mcphersont@bnpmedia.com. Letters must include the sender’s address, phone number and email address, when possible. Letters may be edited for space and clarity.

Join the ASI community at www.adhesivesmag.com/connect.