ROBNOR RESINLAB: Epoxy Foam for Void-Filling Applications
According to the company, this epoxy foam offers good adhesion to a variety of substrates, is particularly suitable for void-filling applications, and has good compressive strength for the backfilling of parts.
Robnor ResinLab recently announced the launch of a new development material, PX19-GE3259-03. According to the company, this epoxy foam offers good adhesion to a variety of substrates, is particularly suitable for void-filling applications, and has good compressive strength for the backfilling of parts. It can also be used in the casting of buoyant materials or as a machinable epoxy foam for model making.
The lightweight foam has a low density of approximately 0.25 g/cm. Since a relatively small amount of material is required to fill a large volume, material waste and cost are reduced. In addition, PX19-GE3259-03 reportedly offers good thermal post-cure performance and has an operating temperature of up to 150°C.