BOSTIK: Engineering Adhesives for Electronics Manufacturing
The new versatile and single-component hot-melt polyurethane reactive range has been designed specifically for the manufacture of miniaturized handheld and wearable electronic devices.
Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector in the assembling, waterproofing, dustproofing, and serviceability of miniaturized electronics such as wearables and handheld devices, as well as larger applications such as smart meters and LED lights. These methoxyethyl cyanoacrylate (MECA) and dual-cure Light Lock adhesives (patented in multiple countries) are already available for electronics OEMs for high-precision instant bonding, encapsulation, and potting applications. Coupled with automatic dispensing solutions, they provide high-performing and convenient options for designers and engineers.
Bostik reports that its new versatile and single-component hot-melt polyurethane reactive (HMPUR) range has been designed specifically for the manufacture of miniaturized handheld and wearable electronic devices such as mobile phones, smart watches, and headphones. High-performance HMPUR products are available with a range of viscosities and open times to suit different applications and assembly processes. These adhesives reportedly deliver excellent bonding performance (both rigid and elastic) and are capable of withstanding fluctuations in temperature and humidity, as well as being resistant to impact and chemical or organic compounds such as sweat or sebum.