February 2013 Issue Highlights
February 2013 issue
Adhesives, Sealants and Horseshoe Nails
Adhesives, Sealants and Horseshoe Nails: The failure of an adhesive, coating or encapsulant can have dire consequences in electronics applications.
Hot Melts Heat Up
Hot Melts Heat Up: New hot-melt adhesives can resist both heat and water.
Celebrating Coatings
Celebrating Coatings: The European Coatings Show and Congress will be held March 18-21 in Nuremberg, Germany.
Options for Polyurethane Chemistry
Options for Polyurethane Chemistry: The use of aliphatic diisocyanates and their derivatives can provide many benefits for thermoplastic materials.
Advances in Tape
Advances in Tape: BeneHold tape strips replace adhesive tapes that are traditionally packaged in rolls.
Novel Testing and Quality Control
Novel Testing and Quality Control: Distinctive data can help convince customers to allocate time and resources to trial a product in their application.
New Approaches for VOC Emissions
New Approaches for VOC Emissions: Specifications for VOC emissions continue to evolve in the U.S. and Europe.