Total North American printed circuit board shipments in October 2019 were up 6.2% compared to the same month last year.
December 9, 2019
IPC-Association Connecting Electronics Industries recently announced the October 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program.
According to Vertellus, its adhesives, sealants, and gels are helping a variety of device manufacturers maintain product integrity in the face of increasingly harsh environments.
October 30, 2019
At the recent K 2019 event, Vertellus showcased its portfolio of adhesives and sealants.
On average, surveyed U.S. electronics companies report they have seen tariff increases on 31% of the total dollar value of the products they import.
October 25, 2019
According to a member survey conducted by IPC from September 25-October 2, almost 90% of U.S. electronics manufacturers are troubled by the higher tariffs imposed by the U.S. and China on each other’s imports.
Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
August 16, 2019
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
SEMICON West will reportedly take aim at global electronics manufacturing industry disruptors with programs and pavilions focused on critical areas of industry growth.
June 28, 2019
The 49th SEMICON West will be held July 9-11, 2019, at the Moscone Center in San Francisco.
Total North American printed circuit board shipments in March 2019 were up 19.1% compared to the same month last year.
May 3, 2019
IPC-Association Connecting Electronics Industries® recently announced the March 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program.