Increasing silicon production without bolstering domestic advanced packaging capabilities is likely to lengthen the semiconductor supply chain because chips will still have to be sent abroad for packaging and assembly into finished products.
December 9, 2021
A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.
October is shaping up to be an exciting month, with two major in-person industry events: The Adhesive and Sealant Council’s (ASC) Annual Convention & EXPO and The ASSEMBLY Show. Both events will feature various learning and technical sessions, exhibitions, and myriad networking activities to provide attendees with opportunities to expand their knowledge and interact with peers.
The methods for dispensing adhesives, epoxies, grease, silicone, oils, sealants, and a multitude of other assembly fluids cover a wide spectrum of techniques—from manual applications like squeeze bottles, toothpicks, and hand-plunger syringes to semi-automated tabletop dispensing robots. Each dispensing method presents unique challenges as manufacturers attempt to scale the sophistication of their fluid dispensing processes to meet requirements for quality, volume throughput, and cost efficiency.
Ultraviolet (UV) light-emitting diode (LED) curing technology offers significant advantages compared to traditional mercury UV curing. As a result, adhesive bonding, sealing, and coating processes in factory assembly lines are rapidly upgrading to UV LED curing technology.
The U.S. Partnership for Assured Electronics was established in 2020 with a mission to ensure the U.S. government has access to resilient and trusted electronics supply chains.
March 2, 2021
The U.S. Partnership for Assured Electronics (USPAE) is inviting electronics manufacturers and related companies to participate in its programs, highlighting the opportunities to collaborate with industry peers and the U.S. government.
Henkel will leverage services from NC State’s Packaging Research in Electronic Energy Systems (PREES) lab facilities as part of the agreement.
March 2, 2021
Henkel and North Carolina State University's Future Renewable Electric Energy Delivery and Management (FREEDM) Systems Engineering Research Center recently announced a new partnership agreement designed to study the impact of materials technology on power electronics applications.