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Lightweighting of structures and combining of materials to take advantage of their best properties is becoming a part of engineering design, and adhesives will play an increasing role in those future designs and applications.
Lightweighting of structures is most often associated with automotive structures. However, lightweighting is a challenge across the transportation sector, including trucks, trailers, buses, passenger rail cars, and even heavy earth-moving equipment and cranes.
Whether using a silicone adhesive in an aerospace assembly or manufacturing silicone bakeware, post-cure for silicone is not a process that belongs in the past.
Original equipment manufacturers (OEMs) may find that post-curing can bring value to certain applications. To determine if post-cure is the best option, it’s important to better understand what is happening during the process, the advantages it offers, and key best practices.
According to Cotronics, its Durabond™ 7032 stainless steel aluminum putty has the ability to bond, repair, and seal high-temperature equipment up to 2,000˚F.
We use RTV silicones in our assembly operations, and our workers keep complaining about the strong vinegar smell. Somebody told me that we might be able to get low-odor, low-volatile silicones. What issues should we be aware of?
Room-temperature vulcanizing (RTV) silicones are well-known for their extreme durability. They are convenient one-component sealants that cure by reaction with moisture from the atmosphere.
IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain.
Increasing silicon production without bolstering domestic advanced packaging capabilities is likely to lengthen the semiconductor supply chain because chips will still have to be sent abroad for packaging and assembly into finished products.
A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.
October is shaping up to be an exciting month, with two major in-person industry events: The Adhesive and Sealant Council’s (ASC) Annual Convention & EXPO and The ASSEMBLY Show. Both events will feature various learning and technical sessions, exhibitions, and myriad networking activities to provide attendees with opportunities to expand their knowledge and interact with peers.
Nearly 900 plant engineering and management personnel from diverse industries within the U.S. weigh in on specific challenges they face relating to their dispensing methods.
The methods for dispensing adhesives, epoxies, grease, silicone, oils, sealants, and a multitude of other assembly fluids cover a wide spectrum of techniques—from manual applications like squeeze bottles, toothpicks, and hand-plunger syringes to semi-automated tabletop dispensing robots. Each dispensing method presents unique challenges as manufacturers attempt to scale the sophistication of their fluid dispensing processes to meet requirements for quality, volume throughput, and cost efficiency.
